IBM has unveiled a new design for embedded Dynamic Random Access
Memory (eDRAM) chips that promise to speed up processor
performance.
eDRAM modules are embedded on a CPU, allowing the processor to
quickly access commonly-used data. Standard DRAM modules are
located outside of the CPU, and require more power than embedded
modules.
The new chip uses silicon on insulator (SOI) technology to reduce
leakage and improve speed. IBM also said that the new architecture
will allow for denser merory modules.
IBM said it hopes to introduce the chips by 2008 as part of the
firm's forthcoming 45 nanometer processors.
IBM's use of embedded DRAM for the last four years has been limited
to specialized, custom-built chips. That trend is likely to
continue with the new design, said Insight 64 founder and principal
analyst Nathan Brookwood.
"This does not replace the separate DRAMs that are used in PCs,
servers or even in a lot of embedded equipment, because you can't
beat the price of standard DRAMs," Brookwood said.
"But for people working on specialized designs where they might use
standard DRAM on a custom chip, this is an attractive alternative
because it uses less power and is much denser."
Where end-users may end up finding the chips, said Brookwood, is in
graphics-heavy equipment, such as gaming consoles and video
cards.
"Typically, if you look at game consoles, they don't have the same
memory footprints that a PC has," the analyst explained, "3d
graphics controllers might use high-speed dram as a graphics
buffer."
In those cases, the performance boost gained from having the buffer
embedded on the graphics processer and the larger capacity offered
by the new, denser IBM module could be extremely attractive to
chipmakers, Brookwood said.